Huawei TaiShan 200 OCP NIC 3.0 Slots
There are two OCP NIC 3.0 slots on the rear of the motherboard. One of them is unpopulated in our system.
The second one holds what is perhaps the most interesting OCP NIC 3.0 card we have seen, at least in the quad 1GbE configuration.
This card does not use an Intel i350 NIC to provide four 1GbE ports as we see in most servers. We also do not have an array of Intel i210 NICs that we see on low-end servers. There are no Broadcom or Marvell equivalents either. Instead, we get four Realtek NICs.
This card has four RTL8211 1GbE NICs. That is somewhat laughable as the card is also set up with an OCP NIC 3.0 x16 connector designed for many times that bandwidth. Normally we see RTL8211 NICs on low-end desktop PCs such as in the sub $200 segment. It is very uncommon to see these in dual-socket servers except sometimes as PHYs for a management port.
On the topic of management, that is equally as intriguing. One can see that the management board is between the two OCP NIC 3.0 slots, and that is what we will look at next.
Huawei TaiShan 200 Management
The management board has the BMC as well as provides features such as the rear I/O’s management port, RJ45 serial port, USB ports, and VGA port. It is not designed to be as easily swapped as the OCP NIC 3.0 cards, but one can see it is using a similar edge connector. This is more designed to be customized during the server’s build.
The card is most notable because of the chip that is on it. This is a HiSilicon Hi3052. Our best guess is that this is the BMC. We can see a Realtek NIC, storage, and DRAM next to it, similar to what we would see with an ASPEED series BMC.
There are some strange things about this chip. One is that searching “HiSilicon Hi3052” does not yield any results on Google. Simply “Hi3052” gets us HI-3052 a hexene copolymer for injection molding. This appears to be a chip without documentation.
Next, let us look at the block diagram and the Kunpeng 920 CPUs.