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Intel Lakefield Hybrid SoC Detailed

Intel Lakefield is a 3D Foveros SoC with a number of firsts including an IO die, hybrid cores, and DRAM all into a low power package

Intel Omni-Directional Interconnect and Co-EMIB

Intel is getting heavy into glued together chips with its new Co-EMIB technology in the short term and ODI and MDIO in the longer term

Intel Foveros is Awesome Do Not Worry

We show why Intel Foveros is awesome as a new 3D chip stacking technology set to disrupt EMIB as the go-to multi-chip packaging option for Intel