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AI
Server
Server Systems
Server CPUs
Accelerators
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Other Components
5G Edge
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Arm Joins the NVIDIA NVLink Fusion Ecosystem
Cliff Robinson
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November 17, 2025
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Microsoft Etches Complex Microfluidics Channels Directly into Silicon Chips
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SK hynix Produces HBM4 Faster than JEDEC Specs Entering Mass Production
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Marvell Shows Dense SRAM Custom HBM and CXL with Arm Compute at Hot Chips 2025
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Fabric8Labs ECAM Enabled Thermal Solutions at Hot Chips 2025
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Intel Optane $559M Impairment with Q2 2022 Wind-Down
Cliff Robinson
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July 28, 2022
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OCP BoW or Bunch-of-Wires Specification Announced
Cliff Robinson
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July 19, 2022
0
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Samsung GDDR6 24Gbps 16Gb DRAM Launched
Cliff Robinson
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July 14, 2022
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The 2022-2023 Intel Data Center Chips First-Look
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May 17, 2022
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Samsung Launches 512GB CXL Memory Module
Cliff Robinson
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May 10, 2022
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How Liquid Cooling is Prototyped and Tested in the CoolIT Liquid Lab Tour
Patrick Kennedy
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May 9, 2022
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How Liquid Cooling Servers Works with Gigabyte and CoolIT
Patrick Kennedy
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April 6, 2022
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Intel C741 Emmitsburg Chipset with PCIe Gen3 for Sapphire Rapids Launched
Cliff Robinson
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March 27, 2022
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Deep Dive into Lowering Server Power Consumption
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February 21, 2022
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JEDEC Publishes JESD238 HBM3 Spec For Next-Gen Accelerators
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January 28, 2022
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PCI-SIG Releases 256GBps PCIe 6.0 x16 Spec
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January 11, 2022
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Liquid Cooling Solutions Run-Through from SC21
Patrick Kennedy
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November 17, 2021
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