At Financial Analyst Day 2022, AMD released its newest roadmap updates stretching across the company. AMD generally breaks its product roadmaps into two chunks. First, its building blocks. Second its products that it builds from those building blocks. We are going to split the roadmaps into the Zen, Ryzen, EPYC, GPU, and then the embedded AI and software roadmaps and go through each quickly in a video format to accompany the pieces earlier this week.
AMD 2022 Roadmaps Organized by Architecture and Segment
For those that would prefer to just listen along instead of reading several pages of event text and slides we have a video version here:
As always, we suggest opening this in a new tab or app for a better viewing and listening experience.
The goal was to pull out the roadmap bits from a lot of the marketing and financial reporting parts ofthe presentations this week. AMD had 4-5 hours of content, so we thought that it would make sense to distill all of that information into the key roadmaps. First, we covered the AMD Zen roadmap and the transition to Zen 4 and Zen 5.
That included the Ryzen notebook roadmap.
As well as the desktop Ryzen roadmap starting with the Ryzen 7000 series and looking ahead. Get ready for the Zen 4 AMD Ryzen Threadripper!
After that, we discussed the server roadmap and AMD EPYC 7004 Genoa and Bergamo. We also talk about the new AMD Siena and Genoa-X server CPUs.
Then we transitioned to the GPU side with a quick discussion on the AMD RDNA 3 and roadmap.
We spent more time on the AMD CDNA roadmap and specifically the massive AMD Instinct MI300 APU.
We briefly covered the new 4th Gen AMD Infinity Architecture.
AMD also shared a little bit on its embedded roadmap.
That also included how AMD is planning to use the Xilinx AI Engine (AIE) in chips like Ryzen parts.
AMD is also unifying its AI software.
There is a ton.
Final Words
Overall, there is a lot in this video, but we wanted to get it out so our readers can see all of the new disclosures that AMD made on its roadmap, and also why those disclosures are important. If you want to read the original articles, you can find them below:
- AMD Technology Roadmap from AMD Financial Analyst Day 2022
- AMD EPYC Update at AMD Financial Analyst Day 2022
- AMD Data Center Solutions at AMD Financial Analyst Day 2022
- AMD-Xilinx and AI Updates at AMD Financial Analyst Day 2022
AMD has a lot of excitement around themselves right now as they’ve been executing on their goals. The maturity of their chiplet approach to design is paying off. The Xilinx acquisition is already coming into play with that strategy.
The interesting thing is that AMD doesn’t need to have a perfect batting average on execution to pull this off successfully. The chiplet approach lets them iterate faster but if a new chiplet falls behind, if the previous generation still works well, they can move forward using the older component. I do hope that AMD has a sense of not flooding the market with new parts as we could be seeing a series of rapid releases. In the next 18 months, I’d expect Zen 4, Zen 4c and Zen 4 with V-cache all on the the same base platform. Good stuff if you know how your workloads behave across different architectures.
What is missing was any in-house networking discussion. I would expect AMD to acquire a networking vendor in the next few years to round out their portfolios. Intel and nVidia are heavily invested in this segment and it is only a matter of time before they fully integrate their NIC and off-load accelerators onto the same package as their CPU/GPU etc. The concept of the DPU will simply become another fully integrated part and AMD currently has nothing in this area due to the lack of modern networking IP.
The other lacking thing is the software side. Yes simplifying the stack is a good thing but historically AMD does not have the best record in terms of software quality.
Overall a good outlook and the competition is healthy.
With Moore’s Law loosing traction. Silicon packaging will be the future. In fact, packaging has been lagging behind for quite a while. With advancement in packaging, we will experience the next silicon tech leap forward.