This week, we grabbed a few photos at AMD’s Advancing AI 2025 event. We thought they would be worth showing since AMD said it is already shipping the Instinct MI350 series to customers.
AMD Instinct MI350 Package
Here is a straight-on shot of the AMD Instinct MI350 package. You can see the eight HBM3E 12-high stacks around the central compute tiles and two I/O dies.
Here is the package from a different angle.
AMD had the pad side affixed to a stand, but here is what the pads look like on the other side.
The GPU package is then soldered onto its OAM board to make an OAM package that can be installed in servers.
That OAM package is installed into an OCP UBB.
AMD Instinct MI350 UBB
Here is the MI350 OAM package installed into a UBB alongside seven other GPUs for a total of eight.
Here is another angle of that.
Here is a look at the entire UBB with eight GPUs installed.
In a lot of ways, this is similar to the previous generation AMD Instinct MI325X board, and that is the point.
On one end, we have the UBB connectors and a heatsink for the PCIe retimers.
There is also a SMC for management.
Beyond the board itself, is also the cooling.
AMD Instinct MI350X Air Cooling
Here is an OAM module with a big air cooling heatsink. This air cooling is the AMD Instinct MI350X.
Here are eight of these on the UBB. This is similar to what we saw above, just with the eight big heatsins.
Here is another view of the heatsinks from the SMC and handle side.
For some reference, here is the AMD MI300X’s UBB:
AMD also has the MI355X liquid-cooled version of this which allows for higher TDP and higher performance per card.
Final Words
Is always neat to see new generations of AI chips. We still have some AMD Instinct MI325X content coming up, but this new generation we expect to ramp this year. With 2304GB of HMB3E on each UBB, this has a lot of memory.
Do you know what they are using for gpu to gpu communication for this system?
Also, what are they using for N/S communication?
Seeing the fully populated baseboard and all eight accelerators with heatsinks, I can’t imagine this thing weighs any less than 600 to 800 pounds when completely assembled, case and all. What a monster. I’d bet just ONE of the complete OAM cards has to weigh a good 15 or 20 pounds just due to all the copper and steel bolted to it.
@Stephen, search for:
GPU-AMD-MI300X-OAM-0045H “6 kg”
It says six kg for 8 OAMs, like what is shown in the last three images.
Do you know if there’s a vendor which allows for not fully populated configurations? I would like to buy a single card and keep adding more with time (for financial reasons)
@Sheevy, there is this generations old MI210 GPU PCIe card for U$8K: https://www.amd.com/en/products/accelerators/instinct/mi200/mi210.html
The ‘355 version will be out later, allowing a single GPU (or more) in a system.
I’ve seen something somewhere that allowed a couple of OAM boards (instead of 8), but couldn’t find it in a recent search. The OAM modules are more powerful than the PCIe cards, but commit you to a U$1/4M system.
Thanks, @Rob.
6 kilos is in the ballpark of my estimate of the weight of one OAM card, plus heatsink and support frames. That translates to just over 13 pounds per module. So yeah, just under the lower bound of my estimate. For the full set of eight OAMs, that’s 48 kilograms, or just shy of 106 pounds just for the GPU complement! OUCH! Not the two to three hundred pounds I initially expected but still very heavy! That means the whole server when fully assembled as shipped from the factory is probably more like 300 or 400 pounds. Still a lot of mass.
As @Rob says, it clearly says 6 kg for an assembly with 8 OAM – not for a single OAM.
@Frank Are you sure? That doesn’t seem right. I just searched Rob’s suggested term and I got exactly two articles, one in Czech and the other in Polish, neither of which I speak. Both claim to be Supermicro articles.
I almost feel like that “6 kg for an assembly with 8 OAM” is a typo. Maybe it’s actually supposed to be 60 kilos for the whole set of 8 OAM modules and not 6. That would make more sense. Unless they’ve figured out how to magically reduce the atomic density of copper and steel somehow and now suddenly they weigh the same as a similarly thick slab of acrylic plastic.
Given how thick that thermal plate between the heatsink and the module itself, that copper-colored layer of metal with the short vertical fins on it just below the huge stack of horizontal fins, I’m pretty sure that value you and Rob are giving me is wrong. But, if you want, mail me one of these things and a good accurate 20 kilo capacity scale so I can weigh the thing myself and I’ll get back to you.
Pricing suggest that this link (in English none the less) is for a 8 OAM unit: https://smicro.eu/amd-instinct-mi300x-192gb-hbm3-100-300000045h
Maybe there’s an error with the reported weight of 6 Kg, I have no idea. But it clearly says 6 Kg…