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Microsoft-Maia200-Hero
At Hot Chips 2026, Microsoft is going into new detail on Maia 200, their second-generation server AI inference processor
Cerebras CS-4 Hot Chips 2026 Backpack Details
At Hot Chips 2026, wafer scale engine developer Cerebras is talking about the next generation of their giant accelerators, as well as how the company is going rack-scale thanks to their Nexus platform architecture
NVIDIA Groq 3 LPX Rack
The newest member of NVIDIA's AI hardware family, at Hot Chips 2026 NVIDIA is diving into the use of LPUs as part of Vera Rubin clusters. The specialized chips from acquihire Groq are being tapped to offer significantly lower latency in the decode phase of inference
Meta MITA Hot Chips 2026 MTIA 400 What's New
For Hot Chips 2026, Meta is at the show to discuss their AI inference accelerators. The MTIA family, the company has an ambitious roadmap to release 4 accelerators over the next couple of years
Hot Chips 2026 NVIDIA Spectrum-X Multiplane Network Architecture Slide 16 Spectrum-X Ethernet Multiplane Extends AI-Factory Scale by 64X
At Hot Chips 2026, NVIDIA showed how Spectrum-X and a multiplane network is its vision for AI Factory networks
AIVRES Booth Tour NVIDIA Bluefield 4 2
At Hot Chips 2026, NVIDIA is detailing the huge upgrades in its BlueField-4 DPU along with the reasons behind it and its scale-in networking
Broadcom Thor Ultra 800GbE Controller 1
At Hot Chips 2026, we got a lot of detail on how the Broadcom Thor Ultra 800GbE NIC works and some of the performance views
Hot Chips 2026 XCENA MX1 CXL Slide 2 (Memory Xcelerator)
At Hot Chips 2026, XCENA showed off how the MX1 combines a CXL memory controller with 3072 RISC-V cores and tiering to SSDs, and Samsung showed how it scales
Hot Chips 2026 Samsung LPDDR5X PIM Slide 6 LPDDR5X-PIM Architecture
Samsung has a new generation of its LPDDR5X-PIM solution at Hot Chips 2026. This processing in memory solution looks more polished this generation
Hot Chips 2026 AMD Versal RF Slide 2 Continuing Leadership in Integrated RF
The AMD Versal RF devices are getting there time on stage at Hot Chips 2026 with hardend IP blocks to flexible FPGA fabric