In our STH Q3 2026 Letter from the Editor we go into all that has happend in Q3 from the changing industry, to the behind-the-scenes
The Kioxia XL1 is an XL-FLASH Generation 2 NAND device that is attached to a system as a 512GB memory expansion device via CXL
We travel to the Arm ATE lab to see what goes into bringing up a new Arm server processor, the Arm AGI CPU. It is lab tour time!
At its investor day, onsemi announced its new Embedded Power Platform for AI racks, automotive, and industrial applications
Astera Labs is launching a new generation of Leo smart memory controllers. The Leo 2 series adds support for CXL 3.2 and PCIe Gen6, while the ambitious Leo X brings the ability to attach memory expanders directly to the fabric networks of AI accelerators
Today we are taking a look at Dell's 16-inch laptop for mainstream business segment, the AMD-based Dell Pro 5 16. The pro laptop hits all the high notes, pairing an AMD Ryzen AI 9 HX PRO 470 processor with great modularity and a good balance between size, weight, and performance
At Hot Chips 2026, Infineon presented a case for using RISC-V in various automotive processors in next-generation cars
d-Matrix and NVIDIA announced that d-Matrix will use NVLink Fusion to scale up and out with its next-gen Raptor AI accelerators
Today we are taking a look at ASUS's premium motherboard for the new Xeon 600 workstation platform, the Pro WS W890E-SAGE SE. A showcase for the platform, the SAGE SE supports Xeon 600's full capabilities, while looking to appeal to both businesses and enthusiasts alike
Qualcomm disclosed more on its next-gen Oryon CPU, Adreno GPU, and Hexagon NPU that will power next-gen devices