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IBM Z Telum Cover
The IBM Z Telum was a hot subject at Hot Chips 33 and we got to see how the next generation of mainframe processors will innovate
AMD HC33 Zen 3 Cover
At Hot Chips 33, AMD discussed Zen 3 including its 3D V-Cache prototype that offers 96MB L3 cache per CCD and 192MB on the Ryzen chip
HC33 Intel Alder Lake Summary
At Hot Chips 33, we learned about Intel Alder Lake that is the company's mainstream hybrid processor powering next-generation client devices
HC33 Samsung DDR5 Cover
At Hot Chips 33, Samsung showed off technologies around its 512GB DDR5 memory offering more performance en route to TB scale DRAM modules
Kingston A2000 1TB
In our Kingston A2000 1TB NVMe SSD review, we see how this entry-level drive from Kingston compares to our growing data set
Intel Arc Xe Core
At Intel Architecture Day 2021, we got new details on the Xe HPG renamed the Intel Alchemist GPU slated for early 2022 release
Dell EMC PowerEdge XE8545 Front With Fans And Bezel
In our Dell EMC PowerEdge XE8545 review, we see how this AMD EPYC 7003 and NVIDIA A100 "Redstone" platform brings high-end GPUs to Dell users
Intel Architecture Day 2021 Sailesh With Sapphire Rapids Close
Intel Sapphire Rapids Xeon CPUs featured prominently at Intel Architecture Day 2021 with new details and disclosures we get into them
Intel Architecture Day 2021 Ponte Vecchio OAM Module
The Intel Ponte Vecchio is a spaceship of a GPU that required Intel's chipbuilders to innovate across many vectors
Intel Architecture Day 2021 IPU Mount Evans ASIC1 1
New Intel IPUs with Agilex and Xeon D are announced along with Mount Evans the company's first DPU IPU ASIC that sheds x86 for Arm Neoverse