FS S5860-20SQ Internal Hardware Overview
Inside the switch, one may be interested to find that the PCB is relatively small even given the relatively large amount of room in the chassis and the higher port count.
The main PCB has the headers for the fans and power supplies, the switch chip and controllers, along with the ports.
One interesting aspect is the port cages. The SFP+ port cages have perforations. The higher-speed SFP28 cages do not. One may assume that the SFP28 cages need more airflow, but this is apparently not the case.
The airflow of the chassis is port to power supply. Between the two fan modules and the two power supplies, there are four fans. This is not an ultra-high power consumption switch so the cooling needs are relatively modest.
The two fan modules are on long carriers that attach to the chassis. We would have liked if these were standard 4-pin PWM fans so they could be swapped easily if needed. Instead, the four pins go to two different connectors which is a different design.
The main feature of the switch is the switch chip which is covered by a modest heatsink, but by far the largest heatsink in the chassis.
Under this heatsink is the Broadcom BCM56170 which has an Arm A9 processor as well as all of the connectivity. This switch chip has Layer 3 processing capabilities as well which is a bit more than one may have expected in a switch of this price/ class. Reading the Broadcom materials, this was designed to also be a multi-gig switch chip with uplinks. We hope to see a high port count 2.5GbE solution with this switch one day.
If you remember the large vent on the side of the chassis, FS channels air from that vent to the main motherboard PCB. Realistically, the entire side of the chassis is not being used.
Hopefully, that hardware overview gives you a sense of what you get in this switch. Next, we are going to take a look at performance and management.