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Hot Chips 2026 Waymo Sensor Fusion carTPU Slide 5 Key specifications
At Hot Chips 2026, we learned more about the Waymo Sensor Fusion processor and how it is solving autonomous driving with custom silicon
Hot Chips 2026 Intel Diamond Rapids Slide 14 Diamond
At Hot Chips 2026, Intel showed off its next-gen 2027 Diamond Rapids server CPU with up to 256 cores per socket
Arm AGI Hot Chips 2026 AGI CPU
At Hot Chips 2026, Arm is showcasing their AGI data center CPU, the company's first complete commercial CPU design. Based around Arm's Neoverse V3 CPU cores, AGI is designed to power the next generation of agentic AI servers
Fujitsu Monaka Hot Chips 2026 Processor Overview
At Hot Chips 2026, Fujitsu outlined its upcoming Monaka CPU, a highly efficient Arm-based CPU for data centers and AI workloads
NVIDIA Vera CPU
At Hot Chips 2026, NVIDIA went into detail on its upcoming Vera server CPU, and the Olympus CPU architecture. With 88 cores per chip, NVIDIA has ambitious aims for its in-house designed CPU architecture
Intel Core Series 3 Chip
At Hot Chips 2026, Intel went deeper into its newest budget SoC design, Wildcat Lake, which is being used in consumer and edge devices
Hot Chips 2026 IBM Z and LinuxONE Slide 36 Enterprise GenAI
At Hot Chips 2026, IBM showed a crazy new IBM Z CPU that will support IBM Z and Arm instruction sets natively.
d-Matrix Raptor 3D-DRAM
At Hot Chips 2026, d-Matrix showed off its Raptor 3D-DRAM accelerator for AI breaking free of using HBM for memory by stacking DRAM and logic
SK hynix HBM is a 3D-stacked structure, which has a base die and a stack of
At Hot Chips 2026 SK hynix presented some of the challenges around HBM and packaging the memory for AI accelerators
Samsung High Bandwidth Memory (HBM)
At Hot Chips 2026, Samsung discussed how it plans to evolve the HBM base die to free up more package area for mroe efficient compute